The TZX30C-TAP belongs to the category of semiconductor devices and is specifically designed for voltage regulation and transient suppression. This product is commonly used in electronic circuits to protect sensitive components from voltage spikes and surges. The TZX30C-TAP is characterized by its high reliability, low leakage current, and fast response time. It is typically packaged in a small, surface-mount package and is available in various quantities to suit different application needs.
The TZX30C-TAP features a standard SOD-123 package with three pins. Pin 1 is the cathode, pin 2 is the anode, and pin 3 is not connected (NC).
The TZX30C-TAP operates based on the principles of Zener diode voltage regulation and transient voltage suppression. When the input voltage exceeds the specified threshold, the device conducts and shunts excess current to protect the circuit.
The TZX30C-TAP is widely used in various electronic systems, including: - Consumer electronics such as smartphones, tablets, and laptops. - Automotive electronics for voltage regulation and transient protection. - Industrial control systems to safeguard sensitive components from voltage transients.
For applications requiring different voltage ratings or power dissipation capabilities, alternative models include: - TZX27C-TAP: 27V voltage rating, 400mW power dissipation. - TZX33C-TAP: 33V voltage rating, 400mW power dissipation. - TZX36C-TAP: 36V voltage rating, 400mW power dissipation.
In conclusion, the TZX30C-TAP is a reliable semiconductor device that provides voltage regulation and transient suppression for a wide range of electronic applications. Its compact size and efficient performance make it a popular choice for protecting sensitive components from voltage spikes and surges.
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What is TZX30C-TAP?
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Where can TZX30C-TAP be used?
How does TZX30C-TAP compare to other adhesive solutions?
Is TZX30C-TAP suitable for outdoor use?
Can TZX30C-TAP be easily removed if needed?
What temperature range can TZX30C-TAP withstand?
Does TZX30C-TAP require special surface preparation before application?
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